TJ Green Associates, LLC

Provides virtual, in-person, and on-site training programs for process engineers, quality inspectors, and technicians in the microelectronics industry.

• Visual Inspection Courses

  Training on MIL-STD-883 and MIL-STD-750 visual inspection standards, including pre-cap, internal, and external visual inspection methods.

• Assembly and Packaging Seminars

  In-depth courses on wire bonding, hermetic sealing, microwave packaging technology, and implantable medical device packaging.

• Workmanship Standards Training

  Utilizes interactive resources and eBooks with over 300 color defect photographs to teach defect recognition in hybrid microcircuits.

Offers specialized technical consulting to develop, validate, and troubleshoot materials and assembly processes for high-reliability microelectronics.

• Materials and Process Development

  Assistance with die attach (eutectic and epoxy), wire bonding (ribbon and deep access), and substrate fabrication.

• Failure Analysis and Root Cause Identification

  Forensic analysis of microelectronic component failures from fielded equipment or production lines to identify defects.

• Process Validation and Testing

  Process optimization and validation using SPC, DOE, hermeticity testing (TM 1014), and Residual Gas Analysis (RGA).

Delivers independent technical expertise and litigation support for cases involving microelectronic packaging, component reliability, and manufacturing defects.

• Technical Expert Testimony

  Provides depositions, trial testimony, and technical reports on microelectronics assembly materials, processes, and failure modes.

• Forensic Engineering Investigation

  Conducts deep technical reviews and physical inspections of failed microchips, sensors, hybrids, and medical implants under dispute.