Prime Circuits Inc

Comprehensive integrated circuit design services for space-qualified and high-performance applications, spanning from initial architecture through back-end physical implementation.

• Ultra-low Power Analog ASIC Design (Space Qualified)

  Development of specialized radiation-hardened and extremely low-power analog circuits for space environments.

• Mixed Signal ASIC Design

  Integration of precise analog front-ends with robust digital control circuits on a single chip.

• Digital ASIC Design

  Logical synthesis, verification, and timing analysis for fully custom digital integrated circuits.

• SoC Design

  Consolidation of complex system architectures, processors, and memory blocks into single-die system-on-chip solutions.

• Back-end IC Design

  Physical layout, routing, DRC/LVS verification, and tape-out preparation for silicon fabrication.

• FPGA Design

  Prototyping, logical design, and optimization for field-programmable gate array deployments.

• Analog Circuitry and Digital Electronic Design

  Board-level circuit design blending discrete high-performance analog and high-speed digital subsystems.

• FPGA to ASIC Conversion

  Migration of verified FPGA designs to highly optimized, lower-power, and radiation-hardened custom silicon.

• Board to ASIC Conversion

  Miniaturization of complex discrete printed circuit boards into high-density integrated ASIC designs.

• Software to FPGA or ASIC conversion

  Acceleration of software-defined algorithms into high-throughput hardware logic architectures.

Development of custom front-end readout ASICs and electronic systems for radiation detector and sensor applications, created in collaboration with research laboratories.

Technical support services for federal research laboratories and other commercial clients needing design and development assistance across multiple domains.

• Software Engineering Support

  Development of low-level software, embedded firmwares, and application suites.

• Information Technology Support

  Network, systems, and infrastructural engineering assistance for technical projects.

• Mechanical Engineering Design Support

  Drafting, modeling, and physical assembly packaging support for electronic instrumentation.