JS Engineering, L.L.C.

Provides specialized integrated circuit dies designed to evaluate thermo-mechanical stresses within semiconductor packages. These devices assist packaging engineers in measuring both in-plane and out-of-plane stress states to ensure structural integrity and long-term reliability.

• Test Chip Supply

  Delivers standard and custom silicon dies in various sizes, ranging from 2.5 mm to 20 mm, to support diverse packaging evaluation needs.

• Test Chip Application

  Assists clients with the integration and implementation of sensor dies into packaging workflows for accurate testing.

• Stress Extraction and Simulation

  Analyzes raw sensor measurements to extract exact stress state data and run predictive thermo-mechanical simulations.

Establishes precise sensor coefficients through specialized mechanical testing. This characterization ensures that raw electrical measurements from the stress sensors map accurately to physical stress values.

• Uniaxial Calibration

  Applies controlled single-axis mechanical loads to establish sensor sensitivity parameters.

• Hydrostatic Calibration

  Subjects sensor dies to uniform fluid pressure to determine hydrostatic stress response coefficients.

• Precision Calibration Fixture Fabrication

  Designs and manufactures custom mechanical fixtures required to hold and load dies during calibration procedures.

Engineers tailored silicon solutions to meet unique packaging dimensions and sensor density requirements. This development covers custom layouts, specialized pad configurations, and targeted sensor placements.

• Wire Bond Stress Test Die

  Develops silicon dies configured for wire-bonded packaging, featuring integrated sensor rosettes, diode thermometry, and subsurface full-area heaters.

• Flip Chip Stress Test Die

  Engineers perimeter-bumped test dies with precise pitch arrays and high-density sensor rosettes optimized for flip-chip assembly analysis.