DVK Integrated Services

DVK Integrated Services provides turnkey PCB layout and design services developed according to a TQM system aligned with ISO 9001 and ISO 9002 requirements.

• High Density SMT and BGA Designs

  Designing large high density SMT boards, quad flat packs, small outline ICs, ball grid arrays, and multi-chip modules.

• High Speed Digital, RF, and Analog Designs

  Engineering high-speed digital, ECL, RF, analog, optical, and mixed-technology board layouts.

• Controlled Impedance Designs

  Designing PCB layouts with common mode and differential controlled impedance requirements.

• Blind, Buried, and Micro Vias

  Incorporating advanced via designs including blind and buried vias, micro vias, and via-in-pad solutions.

• Flex and Rigid-Flex Boards

  Developing flexible and rigid-flex printed circuit boards for challenging mechanical form factors.

• Mil-SPEC and NASA-Compliant Designs

  Developing robust printed circuit boards compliant with strict military and NASA specifications.

DVK Integrated Services delivers complete product development and engineering design services, covering hardware architectures, firmware, and electromechanical design.

• Communications Architecture and RF Development

  Expertise across communications architecture, modulation techniques, RF transceiver development, RF ASIC, and system integration.

• Embedded Microprocessor Systems

  Designing board architectures with advanced microprocessors, microcontrollers, passive backplanes, and DDR2/3/4 memory interfaces.

• Electrical and Mechanical Engineering

  Providing grading studies, Computational Fluid Dynamics (CFD), shadow cast analysis, Finite Element Analysis (FEA), and UL specification verification.

• Software and Firmware Development

  Developing protocol software, firmware, BIOS, and device drivers in C, C++, Python, and assembly code.

Providing turnkey printed circuit board fabrication and assembly services through established Silicon Valley manufacturing partnerships.

• Fabrication Technologies

  Sourcing 2-28+ layer board fabrication, 3mil space and trace, back-drilled vias, and MIL-SPEC materials.

• Assembly Technologies

  Providing wave solder, SMD down to 0201, BGA, press fit connectors, box builds, and testing like ICT, burn-in, and X-ray inspection to IPC-A-610 Class 2 or 3 standards.

• Parts Procurement

  Providing turnkey materials management and component sourcing integrated directly with fabrication and assembly programs.